岗位描述（节选）
Job Responsibilities：
1. Lead next-generation signal integrity architecture from technology concept through product delivery and mass production.
2. Define end-to-end interconnect architectures for board, chassis, tray, cable, and rack-scale copper or optical interconnects. General-purpose x86/ARM servers, storage, and network systems
3. DDR5/DDR6, MRDIMM, SOCAMM/CAMM, and other high-bandwidth mem……
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