Staff Package Design Engineer- experienced in package development of power SiP/module

Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging. Strong understanding on wafer processing such as Front side of metal/Backgrind Backmetal, Taiko Backgrinding, Glass carrier bonding&grinding, Patterned back metal, Embedded die in substrate Package technologies qu…… 完整岗位描述与官方投递入口,请登录后在岗位详情页查看。