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IC Package Design Engineer, Staff

🏢 高通📍 新竹
🎯 社招 发布于 2026-09-08 来源:企业招聘门户(Phenom/Eightfold pcsx多租户)
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岗位描述(节选)

Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work! Role and Responsibilities: Own an…… 完整岗位描述与官方投递入口,请登录后在岗位详情页查看。

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